Overview
Worked with Teneco on R&D for air shock systems, focused on mechanical packaging and integration of embedded sensing/electronics for harsh operating conditions.
Challenge
Packaging embedded electronics and a non-contact ToF sensor within an air shock architecture while maintaining structural integrity, serviceability, and protection against high temperature and pressure.
Solution
Developed detailed CATIA V5 assemblies with integrated mounting concepts for PCB and ToF sensor elements, alongside PCB prototypes designed in Altium Designer and EasyEDA.
Outcome
Successfully integrated non-contact ToF sensor measurement concept into prototype stage with full mechanical packaging readiness across CAD, packaging constraints, and build feedback.
Key Highlights
- •Developed and maintained detailed CATIA V5 assemblies and part models for integration concepts, including space-claim, interfaces, and manufacturable mounting features
- •Designed mounting and housing concepts to embed a PCB within the air shock architecture, accounting for mechanical constraints, fitment, serviceability, and protection of electronics
- •Integrated a non-contact Time-of-Flight (ToF) sensor measurement concept to enable sensing without direct contact
Tech Stack